Title:
IMAGE PICKUP MODULE AND IMAGE PICKUP DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/188013
Kind Code:
A1
Abstract:
This image pickup module is provided with: a substrate, on which an image pickup element is mounted, and in which a through hole is formed; a holding section, which has a supporting pin that is inserted into the through hole such that the supporting pin penetrates the through hole, and which holds an optical system for forming a subject image on the image pickup element; and an adhesive, which is provided in the through hole, and which fixes the substrate and the supporting pin to each other. At least a leading end portion of the supporting pin has a shape that is tapered toward the pin leading end from the pin base side.
Inventors:
OKAMURA MASAYUKI (JP)
YAMAGUCHI AKIHIRO (JP)
KUBOTA CHIEMI (JP)
SHINOHARA HIDENORI (JP)
TAKEUCHI KENICHI (JP)
YAMAGUCHI AKIHIRO (JP)
KUBOTA CHIEMI (JP)
SHINOHARA HIDENORI (JP)
TAKEUCHI KENICHI (JP)
Application Number:
PCT/JP2017/015165
Publication Date:
November 02, 2017
Filing Date:
April 13, 2017
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H04N5/225; G02B7/02; G03B17/02
Foreign References:
JP2007180653A | 2007-07-12 | |||
JP2007174358A | 2007-07-05 | |||
JP2006098497A | 2006-04-13 |
Other References:
See also references of EP 3451647A4
Attorney, Agent or Firm:
SUNNEXT INTERNATIONAL PATENT OFFICE (JP)
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