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Patent Searching and Data


Title:
IMAGE PICKUP MODULE, IMAGE PICKUP MODULE MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2015/104912
Kind Code:
A1
Abstract:
An image pickup module (100) has: a lens unit (10) having a lens group (12); and an image pickup element unit (20), which is fixed to the lens unit (10), and which has an image pickup element (27) that picks up an image of a subject through the lens group (12). The lens unit (10) has: a lens drive apparatus (16); and a flexible substrate (13A), which includes a wiring group (13a) that is electrically connected to the lens drive apparatus (16). The image pickup element unit (20) has a wiring connecting section (24) that is electrically connected to the wiring group (13a) included in the flexible substrate (13A). The flexible substrate (13A) is folded back midway.

Inventors:
TAKASE YOSHIYUKI (JP)
SATO KIYOTO (JP)
FUJINAMI TATSUYA (JP)
Application Number:
PCT/JP2014/081254
Publication Date:
July 16, 2015
Filing Date:
November 26, 2014
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H04N5/225; G03B17/02
Foreign References:
JP2013172390A2013-09-02
JP2008241848A2008-10-09
JP2010192749A2010-09-02
JP2010088088A2010-04-15
Attorney, Agent or Firm:
TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)
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