Title:
IMAGE SENSING CHIP PACKAGING STRUCTURE AND PACKAGING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/114353
Kind Code:
A1
Abstract:
An image sensing chip packaging structure and a packaging method therefor. The image sensing chip packaging structure is provided with an image sensing chip and a control chip used for controlling the image sensing chip. The image sensing chip packaging structure also comprises a substrate, provided with a first surface and a second surface opposite to each other. The image sensing chip is electrically connected to the substrate, and is located on the first surface of the substrate. The control chip is electrically connected to the substrate, and is located on the second surface of the substrate. By applying a stacked packaging technology to the packaging of the image sensing chip, the size of the packaging structure of the image sensing chip is reduced, thereby improving the integration of the image sensing chip.
Inventors:
WANG ZHIQI (CN)
SHEN ZHIJIE (CN)
CHEN JIAWEI (CN)
SHEN ZHIJIE (CN)
CHEN JIAWEI (CN)
Application Number:
PCT/CN2016/112080
Publication Date:
July 06, 2017
Filing Date:
December 26, 2016
Export Citation:
Assignee:
CHINA WAFER LEVEL CSP CO LTD (CN)
International Classes:
H01L27/146
Foreign References:
| CN101211896A | 2008-07-02 | |||
| CN105448944A | 2016-03-30 | |||
| CN205452287U | 2016-08-10 | |||
| CN102623477A | 2012-08-01 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
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