Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
IMAGING DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/198318
Kind Code:
A1
Abstract:
According to the present invention, in a compound eye type configuration provided with a plurality of camera modules, lowering of a yield is suppressed and manufacturing costs are suppressed even when a defect of alignment of a camera module and the like occurs. This imaging device is provided with: a plurality of camera modules; and a support member which supports the plurality of camera modules in a predetermined locational relationship, wherein the plurality of camera modules include a first camera module fixed to the support member, and one or a plurality of second camera modules fixed to the support member by means of an adhesion part formed of an adhesive having characteristics of being peeled off in a predetermined temperature range.

Inventors:
TSUZAKI Seiya (4000-1 Oaza-Haramizu, Kikuyo-machi Kikuchi-gu, Kumamoto 02, 〒8691102, JP)
HOSOKAWA Yasuhiro (4000-1 Oaza-Haramizu, Kikuyo-machi Kikuchi-gu, Kumamoto 02, 〒8691102, JP)
FUJINAGA Yoichiro (4000-1 Oaza-Haramizu, Kikuyo-machi Kikuchi-gu, Kumamoto 02, 〒8691102, JP)
Application Number:
JP2019/004011
Publication Date:
October 17, 2019
Filing Date:
February 05, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi Kanagawa, 14, 〒2430014, JP)
International Classes:
G03B17/02; G03B19/07; G03B35/08; H04N5/225
Domestic Patent References:
WO2017179445A12017-10-19
Foreign References:
JP2016174218A2016-09-29
JPS63201627A1988-08-19
JPH08110433A1996-04-30
JP2015079618A2015-04-23
JP2009171413A2009-07-30
JP2010102313A2010-05-06
JP2009169123A2009-07-30
JP2011029867A2011-02-10
Attorney, Agent or Firm:
MATSUO Kenichiro (7th Floor, Shinkumi Akasaka Bldg. 10-17, Akasaka 1-chome, Chuo-ku, Fukuoka-sh, Fukuoka 42, 〒8100042, JP)
Download PDF: