Title:
IMAGING DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/198318
Kind Code:
A1
Abstract:
According to the present invention, in a compound eye type configuration provided with a plurality of camera modules, lowering of a yield is suppressed and manufacturing costs are suppressed even when a defect of alignment of a camera module and the like occurs. This imaging device is provided with: a plurality of camera modules; and a support member which supports the plurality of camera modules in a predetermined locational relationship, wherein the plurality of camera modules include a first camera module fixed to the support member, and one or a plurality of second camera modules fixed to the support member by means of an adhesion part formed of an adhesive having characteristics of being peeled off in a predetermined temperature range.
Inventors:
TSUZAKI SEIYA (JP)
HOSOKAWA YASUHIRO (JP)
FUJINAGA YOICHIRO (JP)
HOSOKAWA YASUHIRO (JP)
FUJINAGA YOICHIRO (JP)
Application Number:
PCT/JP2019/004011
Publication Date:
October 17, 2019
Filing Date:
February 05, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G03B17/02; G03B19/07; G03B35/08; H04N5/225
Domestic Patent References:
| WO2017179445A1 | 2017-10-19 |
Foreign References:
| JP2016174218A | 2016-09-29 | |||
| JPS63201627A | 1988-08-19 | |||
| JPH08110433A | 1996-04-30 | |||
| JP2015079618A | 2015-04-23 | |||
| JP2009171413A | 2009-07-30 | |||
| JP2010102313A | 2010-05-06 | |||
| JP2009169123A | 2009-07-30 | |||
| JP2011029867A | 2011-02-10 |
Attorney, Agent or Firm:
MATSUO Kenichiro (JP)
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