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Patent Searching and Data


Title:
IMAGING DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/057806
Kind Code:
A1
Abstract:
The imaging device according to one embodiment of the present disclosure comprises: a semiconductor substrate having a first surface and a second surface facing each other, and a pixel array unit in which a plurality of unit pixels are arranged in an array in the row direction and the column direction; a photoelectric conversion unit that is provided on the second surface side of the semiconductor substrate for each unit pixel and generates a charge according to the amount of received light by photoelectric conversion; a charge holding unit provided on the first surface side of the semiconductor substrate for each unit pixel and holding charges transferred from the photoelectric conversion unit; and a first light-shielding unit provided on the semiconductor substrate, located between the photoelectric conversion unit and the charge holding unit, and that includes a first horizontal light-shielding part extending in the in-plane direction of the semiconductor substrate and a first vertical light-shielding part orthogonal to the first horizontal light-shielding portion, wherein the first vertical light-shielding part consists of a first row light-shielding part and a first column light-shielding part formed respectively along two adjacent sides of a rectangular unit pixel, and is provided for each unit pixel located in every other column and diagonally at 45°, and in plan view, the first horizontal light-shielding part is the end portion located at or near the intersection of the first row light-shielding part and the first column light-shielding part provided for each unit pixel located in every other column and diagonally at 45°.

Inventors:
SHIIHARA YU (JP)
Application Number:
PCT/JP2023/029558
Publication Date:
March 21, 2024
Filing Date:
August 16, 2023
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N25/62; H01L27/146; H04N25/70
Domestic Patent References:
WO2022181155A12022-09-01
WO2021111816A12021-06-10
WO2021100556A12021-05-27
WO2021117648A12021-06-17
WO2021112128A12021-06-10
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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