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Patent Searching and Data


Title:
IMAGING DEVICE AND ELECTRONIC INSTRUMENT
Document Type and Number:
WIPO Patent Application WO/2021/106732
Kind Code:
A1
Abstract:
An imaging device according to one embodiment of the present invention is provided with: a first semiconductor substrate which has a first surface and a second surface and which also has a sensor pixel that conduct photoelectric conversion; a second semiconductor substrate which has a third surface and a fourth surface, which also has a readout circuit for outputting a pixel signal based on an electric charge outputted from the sensor pixel, and which is stacked on the first semiconductor substrate so as to have the fourth surface face the first surface; and a wiring layer which is provided between the first semiconductor substrate and the second semiconductor substrate, and which has a first wiring and a second wiring that are electrically connected to each other with one of the first wiring and the second wiring being in an electrically floated state while the other being electrically connected to a transistor provided to the first or second semiconductor substrate.

Inventors:
TOJINBARA HIROKI (JP)
Application Number:
PCT/JP2020/043142
Publication Date:
June 03, 2021
Filing Date:
November 19, 2020
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N5/369; H04N5/3745
Domestic Patent References:
WO2017043343A12017-03-16
WO2018186026A12018-10-11
Foreign References:
JP2011166170A2011-08-25
JP2012147169A2012-08-02
JP2014022561A2014-02-03
JP2019216511A2019-12-19
Other References:
See also references of EP 4068361A4
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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