Title:
IMAGING DEVICE, ELECTRONIC PREPARATION, AND SOLID-STATE IMAGE ELEMENT
Document Type and Number:
WIPO Patent Application WO/2015/115038
Kind Code:
A1
Abstract:
Provided is a low cost imaging device with high image performance.
The imaging device (100) is provided with: a semiconductor chip (1); a package substrate (3) disposed at the backside of the semiconductor chip (1); a wire (7) for electrically connecting the semiconductor chip (1) to the package substrate (3); a transparent substrate (4) to be disposed facing the semiconductor chip (1); and a side wall (9) formed on a surface of the package surface (3) where the semiconductor chip (1) is disposed. The imaging device images an object to be imaged (5) that has been disposed between the semiconductor chip (1) and the transparent substrate (4) in a state in which an encapsulating part (6) is disposed surrounding the object (5).
Inventors:
YAMASHITA HIROKI
KAWABATA TAKESHI
WAGA SATORU
MOTOMURA HIDETO
KAWABATA TAKESHI
WAGA SATORU
MOTOMURA HIDETO
Application Number:
PCT/JP2015/000148
Publication Date:
August 06, 2015
Filing Date:
January 15, 2015
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L27/14; G01N21/17; G02B21/36; H04N5/225; H04N5/335
Foreign References:
| JP2003515107A | 2003-04-22 | |||
| JP2007333440A | 2007-12-27 | |||
| JP2006351772A | 2006-12-28 |
Attorney, Agent or Firm:
FUJII, Kentaro et al. (JP)
Fujii Kentaro (JP)
Fujii Kentaro (JP)
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