Title:
IMAGING DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/181222
Kind Code:
A1
Abstract:
Provided is an imaging device that is capable of ensuring high dimension accuracy. This solid-state imaging device includes a laminate structure of a sensor substrate and a circuit substrate. The sensor substrate has an effective pixel region which includes a plurality of pixels and which is provided with an imaging element, for each of the pixels, capable of generating a pixel signal by receiving external light. The circuit substrate includes a chip in which a first portion having a signal processing circuit for processing the pixel signal and a second portion present, in the in-plane direction, at a position different from the position of the first portion are integrated with each other. Both the first and second portions are provided to positions overlapping the effective pixel region in the direction of lamination of the sensor substrate and the circuit substrate.
Inventors:
YUKAWA MASAHIKO (JP)
Application Number:
PCT/JP2019/003160
Publication Date:
September 26, 2019
Filing Date:
January 30, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/369; H01L27/146
Domestic Patent References:
| WO2015159728A1 | 2015-10-22 | |||
| WO2017209221A1 | 2017-12-07 |
Foreign References:
| JP2014099582A | 2014-05-29 | |||
| JP2009213012A | 2009-09-17 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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