Title:
IMAGING DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/263967
Kind Code:
A1
Abstract:
The present invention is related to a sophisticated imaging device that can be manufactured with a small number of steps. This imaging device is formed by joining multiple layers or layered structures each of which includes a device. For example, a pixel circuit may be provided in a first layer, a memory circuit may be provided in a second layer, and a drive circuit for pixels and a drive circuit for the memory circuit may be provided in a third layer. This configuration makes it possible to form a small imaging device. Also, for example, stacking circuits makes it possible to reduce wiring delay and achieve high-speed operation.
Inventors:
IKEDA TAKAYUKI (JP)
ONUKI TATSUYA (JP)
KATO KIYOSHI (JP)
YAMAZAKI SHUNPEI (JP)
ONUKI TATSUYA (JP)
KATO KIYOSHI (JP)
YAMAZAKI SHUNPEI (JP)
Application Number:
PCT/IB2022/055227
Publication Date:
December 22, 2022
Filing Date:
June 06, 2022
Export Citation:
Assignee:
SEMICONDUCTOR ENERGY LAB (JP)
International Classes:
H01L27/146; H01L21/8234; H01L27/06; H01L27/088; H01L29/786; H04N5/369
Domestic Patent References:
| WO2018109821A1 | 2018-06-21 | |||
| WO2018186192A1 | 2018-10-11 | |||
| WO2003041174A1 | 2003-05-15 |
Foreign References:
| JP2016213298A | 2016-12-15 | |||
| JP2017034677A | 2017-02-09 | |||
| JP2021100025A | 2021-07-01 |
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