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Title:
IMAGING DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/005870
Kind Code:
A1
Abstract:
The present invention facilitates manufacturing of an imaging device having a function for correcting aberration in an imaging-lens optical system. A meta-lens and an imaging element which constitute an imaging device are formed by a semiconductor process. The meta-lens carries out aberration correction in the imaging-lens optical system. The imaging element images incident light which has passed through the imaging-lens optical system. The meta-lens may be formed inside the imaging element or on the surface thereof, or may be formed as a section of a wafer level chip size package.

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Inventors:
DOBASHI EIICHIRO (JP)
Application Number:
PCT/JP2020/018094
Publication Date:
January 14, 2021
Filing Date:
April 28, 2020
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G02B13/00; G02B3/00; G02B7/02; H04N5/225
Domestic Patent References:
WO2019006076A12019-01-03
Foreign References:
US20190064532A12019-02-28
JP2009533885A2009-09-17
US20140263982A12014-09-18
Attorney, Agent or Firm:
MARUSHIMA, Toshikazu (JP)
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