Title:
IMAGING DEVICE, MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/061273
Kind Code:
A1
Abstract:
The present technology pertains to an imaging device and a manufacturing method, enabling improvement of sensitivity of an imaging device that utilizes infrared rays. The present invention is provided with: a light receiving element array having multiple light receiving elements which are arranged in an array and which are each formed of a compound semiconductor that has the light receiving sensitivity in the infrared range; a signal processing circuit that processes signals from the light receiving element; an upper electrode formed at the light receiving surface side of the light receiving elements; and a lower electrode that forms a pair with the upper electrode. The light receiving element array and the signal processing circuit are joined to each other via a film formed of a predetermined material. The upper electrode and the signal processing circuit are connected to each other via a through-hole partially penetrating the light receiving elements. The lower electrode is an electrode in common with the light receiving elements arranged in the light receiving element array. The present technology is applicable to an infrared ray sensor.
Inventors:
MARUYAMA SHUNSUKE (JP)
YANAGITA TAKESHI (JP)
YANAGITA TAKESHI (JP)
Application Number:
PCT/JP2016/077789
Publication Date:
April 13, 2017
Filing Date:
September 21, 2016
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L27/146; G01J1/02; H01L27/14; H01L31/10; H04N5/33; H04N5/369
Foreign References:
| US5318666A | 1994-06-07 | |||
| JP2014060380A | 2014-04-03 | |||
| JP2015149422A | 2015-08-20 | |||
| JP2012129247A | 2012-07-05 | |||
| JP2015162679A | 2015-09-07 | |||
| JPH05218377A | 1993-08-27 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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