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Title:
IMAGING DEVICE AND IMAGING DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/111575
Kind Code:
A1
Abstract:
In order to improve the strength of an imaging module in which the optical axis has been adjusted, this imaging device is provided with an imaging module and a holding unit. The imaging module of the imaging device is provided with an imaging element which images incident light introduced from the top of a housing. The holding unit of the imaging device surrounds and holds the side surfaces of the imaging module adjacent to said top of the housing. By the holding unit surrounding and holding the side surfaces of said imaging module, the imaging module is protected.

Inventors:
TOKUNAGA Junichi (4000-1 Oaza-Haramizu, Kikuyo-machi Kikuchi-gu, Kumamoto 02, 〒8691102, JP)
KISHIGAMI Yuuji (4000-1 Oaza-Haramizu, Kikuyo-machi Kikuchi-gu, Kumamoto 02, 〒8691102, JP)
KAWABATA Noboru (4000-1 Oaza-Haramizu, Kikuyo-machi Kikuchi-gu, Kumamoto 02, 〒8691102, JP)
NABE Yoshihiro (4-14-1 Asahi-cho Atsugi-sh, Kanagawa 14, 〒2430014, JP)
Application Number:
JP2018/039629
Publication Date:
June 13, 2019
Filing Date:
October 25, 2018
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi Kanagawa, 14, 〒2430014, JP)
International Classes:
G03B17/02; G02B7/02; G03B19/07; G03B35/08; H04N5/225
Domestic Patent References:
WO2017179445A12017-10-19
Foreign References:
KR101132209B12012-03-30
KR20130061322A2013-06-11
JP2016174218A2016-09-29
Attorney, Agent or Firm:
MATSUO Kenichiro (7th Floor, Shinkumi Akasaka Bldg. 10-17, Akasaka 1-chome, Chuo-ku, Fukuoka-sh, Fukuoka 42, 〒8100042, JP)
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