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Patent Searching and Data


Title:
IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/136413
Kind Code:
A1
Abstract:
This imaging device has a circuit board (11) and a metal plate (12). The circuit board (11) is located at the back of an outer case (4A), and a semiconductor (10) that processes signals from an imaging unit is mounted on said circuit board (11). The metal plate (12), which is located between the imaging unit and the circuit board (11) inside the outer case, is provided with the following: a first section (12A) that faces the circuit board (11) and mechanically contacts the semiconductor (10) with a contact member (13) interposed therebetween; and two or more second sections (12B, 12C) that are integrally provided on the first section (12A) and are formed by being bent so as to be parallel to an optical axis.

Inventors:
CHIKADA NOBURO
NAKASE KIYOTAKA
IYODA MAKOTO
Application Number:
PCT/JP2014/001083
Publication Date:
September 12, 2014
Filing Date:
February 28, 2014
Export Citation:
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Assignee:
PANASONIC CORP (JP)
International Classes:
G03B17/02; H04N5/225
Foreign References:
JP2009229582A2009-10-08
JP2004325987A2004-11-18
JP2004104168A2004-04-02
JP2011087073A2011-04-28
Attorney, Agent or Firm:
TOKUDA, Yoshiaki et al. (JP)
Yoshiaki Tokuda (JP)
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