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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2019/171879
Kind Code:
An imaging device which is provided with: a pixel region and a peripheral region that is outside the pixel region; a light receiving element which is provided in the pixel region; a circuit board which is provided in the pixel region and the peripheral region, and which comprises a semiconductor substrate and a multilayer wiring layer that is provided between the semiconductor substrate and the light receiving element; a first wiring line which is provided in the multilayer wiring layer, and which is electrically connected to the light receiving element; a protective member which faces the circuit board, with the light receiving element being interposed therebetween; and an expanded wiring part which is provided between the protective member and the semiconductor substrate in the peripheral region. This imaging device is configured such that one end of the expanded wiring part is open, while the other end is electrically connected to the first wiring line.

OOKI, Susumu (4-14-1 Asahicho, Atsugi-sh, Kanagawa 14, 〒2430014, JP)
Application Number:
Publication Date:
September 12, 2019
Filing Date:
February 08, 2019
Export Citation:
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SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1, Asahicho Atsugi-sh, Kanagawa 14, 〒2430014, JP)
International Classes:
H01L27/146; H01L21/3205; H01L21/768; H01L23/522
Foreign References:
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (3F Sawada Building, 15-9 Shinjuku 1-chome, Shinjuku-k, Tokyo 22, 〒1600022, JP)
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