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Patent Searching and Data


Title:
IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/193977
Kind Code:
A1
Abstract:
The present invention includes: a wiring substrate; an imaging element package mounted on the wiring substrate; a package frame attached to a light-receiving surface side of the imaging element package; and a lens holder for retaining a lens part so that the lens part faces a light-receiving surface of the imaging element package, the lens holder being disposed so as to cover the package frame; the package frame being constituted from a material having a larger coefficient of linear expansion than the material constituting the lens holder, and being provided with a wall part extending toward the wiring substrate in a direction perpendicular to the wiring substrate, a gap being provided between the wall part of the package frame and the imaging element package, and between a wall part end of the package frame and the wiring substrate, the lens holder being provided with a wall part facing the wall part of the package frame, and a wall part end of the lens holder being fixed to the wall part end of the package frame in a state of being separated from the wiring substrate.

Inventors:
OKAMOTO Hideo (4-14-1 Asahi-cho, Atsugi-sh, Kanagawa 14, 〒2430014, JP)
MURAI Makoto (4-14-1 Asahi-cho, Atsugi-sh, Kanagawa 14, 〒2430014, JP)
Application Number:
JP2019/011731
Publication Date:
October 10, 2019
Filing Date:
March 20, 2019
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1, Asahi-cho Atsugi-sh, Kanagawa 14, 〒2430014, JP)
International Classes:
G02B7/02; G03B15/00; G03B17/02
Foreign References:
JP2017083816A2017-05-18
Attorney, Agent or Firm:
YAMAMOTO Takahisa et al. (Room 301, Akiba Building 3-2, Ohsaki 4-chome, Shinagawa-k, Tokyo 32, 〒1410032, JP)
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