IMAGING DEVICE - SONY SEMICONDUCTOR SOLUTIONS CORP

Title:

IMAGING DEVICE

Document Type and Number:

WIPO Patent Application WO/2019/235115

Kind Code:

A1

Abstract:

This imaging device is provided with a plurality of temperature detection element units and a plurality of infrared absorption layer units, which are respectively arranged in a first direction and in a second direction. Each temperature detection element unit is composed of a first temperature detection element 21 and a second temperature detection element 22, which are adjacent to each other in the first direction; each infrared absorption layer unit is composed of a first infrared absorption layer 41 and a second infrared absorption layer 42, which are adjacent to each other in the second direction; the first infrared absorption layer 41 is arranged above a first A region 211 and a second A region 221, while being thermally connected to the first temperature detection element 21; and the second infrared absorption layer 42 is arranged above a first B region 212 and a second B region 222, while being thermally connected to the second temperature detection element 22.

Inventors:

OKUMURA KENICHI (JP)
HOSAKA HAJIME (JP)
NITTA YOSHIKAZU (JP)

Application Number:

PCT/JP2019/018222

Publication Date:

December 12, 2019

Filing Date:

May 07, 2019

Export Citation:

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Assignee:

SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

International Classes:

G01J5/02; G01J1/02; G01J1/42; H01L27/144; H01L27/146; H04N5/33

Domestic Patent References:

WO2011036708A1

2011-03-31

Foreign References:

JP2018040791A	2018-03-15
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Other References: