Title:
IMAGING ELEMENT AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/057277
Kind Code:
A1
Abstract:
An imaging element is provided with a semiconductor substrate having a light-receiving part for receiving incident light that is transmitted through a microlens, and a light-shielding part for shielding some of the light that is transmitted through the microlens and is made incident on the semiconductor substrate. The light-receiving part receives incident light that is transmitted through the microlens, between the microlens and the shielding part.
Inventors:
ISHIDA TOMOHISA (JP)
WATANABE YOSHIYUKI (JP)
WATANABE YOSHIYUKI (JP)
Application Number:
PCT/JP2016/078278
Publication Date:
April 06, 2017
Filing Date:
September 26, 2016
Export Citation:
Assignee:
NIKON CORP (JP)
International Classes:
H01L27/146; H01L27/14; H01L31/0232; H04N5/369
Foreign References:
| JP2015095468A | 2015-05-18 | |||
| JP2010212668A | 2010-09-24 | |||
| JP2013098446A | 2013-05-20 |
Other References:
See also references of EP 3358620A4
Attorney, Agent or Firm:
NAGAI, Fuyuki et al. (JP)
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