Title:
IMAGING ELEMENT AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/012143
Kind Code:
A1
Abstract:
The present invention simplifies wiring of signal lines in an imaging element comprising two semiconductor chips.
An imaging element is provided with a pixel chip and a circuit chip. The pixel chip is provided with a plurality of pixels each having a charge transfer part that transfers an electric charge generated in response to incident light to a charge holding part in accordance with a control signal, and a plurality of first control signal transmission parts that transmit the respective control signals to the respective charge transfer parts. The circuit chip is provided with a control signal generation part that generates the control signals for the charge transfer parts of each of the plurality of pixels, and a plurality of second control signal transmission parts that are each provided to correspond to the first control signal transmission part and transmit the respective generated control signals.
Inventors:
ODAHARA MASAKI (JP)
Application Number:
PCT/JP2017/020904
Publication Date:
January 18, 2018
Filing Date:
June 06, 2017
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/378; H01L21/822; H01L27/04; H01L27/146; H04N5/369; H04N5/374
Foreign References:
| JP2013225632A | 2013-10-31 | |||
| JP2015070591A | 2015-04-13 | |||
| JP2013232647A | 2013-11-14 | |||
| JP2006049361A | 2006-02-16 | |||
| JP2011159958A | 2011-08-18 |
Other References:
See also references of EP 3484146A4
Attorney, Agent or Firm:
MARUSHIMA, Toshikazu (JP)
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