Title:
IMAGING ELEMENT, MANUFACTURING METHOD, AND ELECTRONIC EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2019/142661
Kind Code:
A1
Abstract:
The present invention pertains to an imaging element, a manufacturing method, and electronic equipment capable of suppressing shading. An imaging element comprises: a semiconductor substrate with a photoelectric convertor formed for each of a plurality of pixels; a filter layer in which a plurality of filters transmitting light of a given wavelength received by the photoelectric convertor is planarly disposed; and a partition for optically separating each filter disposed in the filter layer. The partition has a different height for each portion of an imaging area made up of the light receiving surface of the pixel. A partition located in the center of the imaging area is made taller than a partition on the periphery. The present invention can be applied, for example, to an imaging element adopting an RCCC pixel array.
Inventors:
YAMAGUCHI TETSUYA (JP)
TAYANAKA HIROSHI (JP)
TAYANAKA HIROSHI (JP)
Application Number:
PCT/JP2019/000032
Publication Date:
July 25, 2019
Filing Date:
January 04, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; G02B5/20; H04N5/357; H04N5/369; H04N9/07
Domestic Patent References:
| WO2017073321A1 | 2017-05-04 |
Foreign References:
| JP2012227476A | 2012-11-15 | |||
| JP2006128513A | 2006-05-18 | |||
| JP2017163010A | 2017-09-14 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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