Title:
IMAGING ELEMENT, METHOD FOR MANUFACTURING IMAGING ELEMENT, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/065293
Kind Code:
A1
Abstract:
The present invention relates to an imaging element that makes it possible to reduce the size of a lens module while ensuring bonding strength between an image sensor and the module, a method for manufacturing the imaging element, and an electronic device. The imaging element is provided with: a layered lens structure in which lens-provided substrates, in which a lens is disposed inside a through hole formed in the substrate, are bonded together by direct bonding and layered; an imaging part for performing photoelectric conversion of incident light collected by the lenses; a protective substrate disposed between the imaging part and the layered lens structure; and an adhesive for bonding a top surface of the protective substrate and a bottom optical surface of the lens of the lowermost layer of the layered lens structure. The present invention can be applied to a camera module or the like, for example.
Inventors:
HIKICHI KUNIHIKO (JP)
Application Number:
PCT/JP2018/034125
Publication Date:
April 04, 2019
Filing Date:
September 14, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G02B7/02; G02B5/00; G02B13/00; G02B13/18; G03B15/00; G03B17/02; H01L27/146; H04N5/225; H04N5/335
Foreign References:
| JP2017032800A | 2017-02-09 | |||
| JP2005019573A | 2005-01-20 | |||
| JP2011180529A | 2011-09-15 | |||
| JP2011119925A | 2011-06-16 | |||
| JP2011097294A | 2011-05-12 | |||
| JP2006100425A | 2006-04-13 | |||
| JP2011199036A | 2011-10-06 | |||
| JP2005317745A | 2005-11-10 | |||
| JP2017032796A | 2017-02-09 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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