Title:
IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2020/012860
Kind Code:
A1
Abstract:
The present invention simplifies a step for forming an on-chip lens of a phase difference pixel. This imaging element is provided with a pixel array unit, an individual on-chip lens, a common on-chip lens, and an adjacent on-chip lens. In the pixel array unit, a pixel that performs photoelectric conversion according to incident light, a plurality of phase difference pixels that are pixels adjacently disposed and detecting a phase difference, and a phase difference pixel's adjacent pixel that is a pixel adjacent to the phase difference pixel are two-dimensionally disposed. The individual on-chip lens is disposed in each pixel, and individually concentrates the incident light onto the pixel. The common on-chip lens is disposed in common to the plurality of phase difference pixels, and jointly concentrates the incident light. The adjacent on-chip lens is disposed in each phase difference pixel's adjacent pixel, individually concentrates the incident light onto the phase difference pixel's adjacent pixel, and is configured to have a size different from the individual on-chip lens in order to adjust the shape of the common on-chip lens.
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Inventors:
NISHI SACHIO (JP)
FUKAGAWA HIRONOBU (JP)
KATO HIDEAKI (JP)
SATOU AKIMITSU (JP)
FUKAGAWA HIRONOBU (JP)
KATO HIDEAKI (JP)
SATOU AKIMITSU (JP)
Application Number:
PCT/JP2019/023301
Publication Date:
January 16, 2020
Filing Date:
June 12, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; G02B5/30; G02B7/34; G03B13/16; H04N5/369
Domestic Patent References:
| WO2016098640A1 | 2016-06-23 | |||
| WO2018008408A1 | 2018-01-11 | |||
| WO2014097884A1 | 2014-06-26 |
Foreign References:
| JP2000349268A | 2000-12-15 |
Attorney, Agent or Firm:
MATSUO Kenichiro (JP)
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