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Title:
IMAGING-ELEMENT MOUNTING SUBSTRATE, IMAGING DEVICE, AND IMAGING MODULE
Document Type and Number:
WIPO Patent Application WO/2019/082923
Kind Code:
A1
Abstract:
This imaging-element mounting substrate comprises a first substrate and a second substrate. The first substrate has a recess on the top surface thereof, and contains an organic material. The second substrate is placed in the recess of the first substrate, has an imaging element mounted on the top surface thereof, and contains an inorganic material.

Inventors:
SOMEI YASUNOBU (JP)
Application Number:
PCT/JP2018/039471
Publication Date:
May 02, 2019
Filing Date:
October 24, 2018
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H01L27/146; G03B17/02; H04N5/225
Domestic Patent References:
WO2013118501A12013-08-15
WO2015199134A12015-12-30
Foreign References:
JP2016122978A2016-07-07
JP2005191448A2005-07-14
JP2007306282A2007-11-22
JP2017168567A2017-09-21
Other References:
See also references of EP 3703128A4
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