Title:
IMAGING ELEMENT MOUNTING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/082608
Kind Code:
A1
Abstract:
This imaging element mounting substrate comprises: a substrate area in which a substrate is arranged; and a plurality of reinforcement parts arranged in the periphery of the substrate area. The plurality of reinforcement parts are independent from one another.
Inventors:
SHIBATA SHUSAKU (JP)
TAKAKURA HAYATO (JP)
KAWAMURA YOSHIHIRO (JP)
ITO MASAKI (JP)
WAKAKI SHUICHI (JP)
TAKAKURA HAYATO (JP)
KAWAMURA YOSHIHIRO (JP)
ITO MASAKI (JP)
WAKAKI SHUICHI (JP)
Application Number:
PCT/JP2018/036759
Publication Date:
May 02, 2019
Filing Date:
October 02, 2018
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L27/146; H01L23/12; H04N5/369; H05K1/02; H05K3/00
Domestic Patent References:
| WO2017135395A1 | 2017-08-10 |
Foreign References:
| JP2009081357A | 2009-04-16 | |||
| JP2010192546A | 2010-09-02 | |||
| JP2008306350A | 2008-12-18 | |||
| JP2010080808A | 2010-04-08 | |||
| JP2010103516A | 2010-05-06 | |||
| JP2016139633A | 2016-08-04 | |||
| JP2013118364A | 2013-06-13 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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