Title:
IMAGING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2021/060098
Kind Code:
A1
Abstract:
This imaging element comprises: a semiconductor substrate having one surface that serves as a light-incident surface; and another surface facing the one surface; and an imaging unit provided on the semiconductor substrate and having a plurality of sensor pixels that perform photoelectric conversion; and a power generation unit provided around the imaging unit on the semiconductor substrate and performing photoelectric conversion.
Inventors:
HANZAWA KATSUHIKO (JP)
Application Number:
PCT/JP2020/035020
Publication Date:
April 01, 2021
Filing Date:
September 16, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L31/10; H04N5/369
Domestic Patent References:
| WO2014007132A1 | 2014-01-09 |
Foreign References:
| JP2018026373A | 2018-02-15 | |||
| US9407845B1 | 2016-08-02 | |||
| JP2017504966A | 2017-02-09 | |||
| JP2007281144A | 2007-10-25 | |||
| JP2010186818A | 2010-08-26 | |||
| JP2010092981A | 2010-04-22 | |||
| JPS571274A | 1982-01-06 | |||
| JP2012199417A | 2012-10-18 | |||
| JP2008066402A | 2008-03-21 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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