Title:
IMAGING MODULE AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/188219
Kind Code:
A1
Abstract:
[Problem] To enable early discovery of diseases and the like and enable a decrease in medical cost by improving spatial, temporal, and energy resolution of an imaging device, such as an optical topography device or an optical CT device, and by greatly improving image diagnosing accuracy through a decrease in size and weight of the imaging device.
[Solution] Provided is an imaging module comprising a semiconductor imaging element including a semiconductor substrate with an integrated circuit formed on a surface thereof, the semiconductor imaging element having a light receiving surface on a side surface portion of the semiconductor substrate which lies in a direction perpendicular to the semiconductor substrate surface, wherein one or a plurality of light source portions are formed on the semiconductor substrate surface, on which the integrated circuit is formed, in such a way that the direction of light emitted from the light source portions is aligned with the normal to the substrate side surface portion. An imaging device using the same may also be provided.
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Inventors:
SHIZUKUISHI MAKOTO (JP)
Application Number:
PCT/JP2017/016288
Publication Date:
November 02, 2017
Filing Date:
April 25, 2017
Export Citation:
Assignee:
SHIZUKUISHI MAKOTO (JP)
International Classes:
H01L27/146; A61B1/00; A61B1/04; A61B8/00; A61B10/00; G01N21/17; H01L27/144; H01L27/15; H01L31/02; H04N5/33; H04N5/369
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