Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
IMAGING MODULE AND ENDOSCOPE
Document Type and Number:
WIPO Patent Application WO/2020/195872
Kind Code:
A1
Abstract:
This imaging module is provided with an imaging element, and a mounting board on which the imaging element, together with a plurality of passive components, is mounted. The mounting board is provided with a first surface on which the imaging element is surface-mounted, a second surface which is located on the reverse side of the first surface and on which the passive component is mounted, a third surface which is continuous with the second surface with a step therebetween and on which the passive component is mounted, and a columnar cable connection block which rises from the second surface and the third surface and to which a cable is connected.

Inventors:
KOMORO ATSUSHI (JP)
Application Number:
PCT/JP2020/010707
Publication Date:
October 01, 2020
Filing Date:
March 12, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HOYA CORP (JP)
International Classes:
G02B23/24; A61B1/04; A61B1/05
Domestic Patent References:
WO2018078766A12018-05-03
Foreign References:
JPH08146310A1996-06-07
JP2006025852A2006-02-02
JP2008177298A2008-07-31
US20170255001A12017-09-07
US20160205296A12016-07-14
Attorney, Agent or Firm:
KOHNO, Hideto et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ANALYSIS DEVICE AND ANALYSIS METHOD

Next Patent: SILICONE COMPOSITION AND FIBER TREATMENT AGENT