Title:
IMAGING MODULE, METHOD FOR PRODUCING IMAGING MODULE, AND ENDOSCOPE
Document Type and Number:
WIPO Patent Application WO/2018/194039
Kind Code:
A1
Abstract:
An imaging module 1 is equipped with: a multilayer element 10 in which an external electrode 20P is positioned on a rear surface 10SB; a first wiring plate 30 provided with a first electrode 32 and a front electrode 31 which is connected to the external electrode 20P via a relay-joining part B3; and a first signal cable 40 connected to the first electrode 32 of the first wiring plate via a cable-joining part B2. The first wiring plate 30 is flexible and has a folded/bent section 30V located inside a space S11 extending in the optical axis direction from a first region 10SB1 among the first region 10SB1 and a second region 10SB2 which are obtained by dividing the rear surface 10SB into two. The length d1 from the relay-joining part B3 to the cable-joining part B2 on the first principal surface 30SA of the first wiring plate 30 is greater than the length d2 from the relay-joining part B3 to the end side 24SS of the first region 10SB1 on the rear surface 10SB of the multilayer element 10.
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Inventors:
IGARASHI TAKATOSHI (JP)
SHIMOHATA TAKAHIRO
SUYAMA TAKURO
SHIMOHATA TAKAHIRO
SUYAMA TAKURO
Application Number:
PCT/JP2018/015774
Publication Date:
October 25, 2018
Filing Date:
April 16, 2018
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
A61B1/04; H04N5/225
Domestic Patent References:
| WO2016166890A1 | 2016-10-20 |
Foreign References:
| JP2009082503A | 2009-04-23 | |||
| JP2012064883A | 2012-03-29 | |||
| JP2004207461A | 2004-07-22 | |||
| JP2015066297A | 2015-04-13 |
Attorney, Agent or Firm:
ITOH Susumu (JP)
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