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Patent Searching and Data


Title:
IMAGING MODULE, IMAGING UNIT, AND ENDOSCOPE DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/015849
Kind Code:
A1
Abstract:
This imaging module (40) is provided with a CMOS imager and a multilayer substrate (46). The CMOS imager comprises a first chip (21) and a second chip (22) that has a transfer buffer (27). The first chip (21) has at least the following: a light-receiving section (23) in which a plurality of pixels that generate and output imaging signals in accordance with the amount of light received are laid out in a two-dimensional matrix pattern; and a read-out section (24) that selects pixels from among the plurality of pixels in order to read out the imaging signals generated thereby. The second chip (22) is mounted, on a first surface (46S) of the multilayer substrate (46), at a prescribed distance from the first chip (21) on a base-end side thereof with respect to the lengthwise direction of the imaging module (40).

Inventors:
YAMASHITA TOMOKAZU (JP)
ADACHI SATORU (JP)
ICHIMURA HIRONOBU (JP)
DAIMARU TATSUYA (JP)
TAKAHASHI TOMOHISA (JP)
Application Number:
PCT/JP2014/061380
Publication Date:
February 05, 2015
Filing Date:
April 23, 2014
Export Citation:
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Assignee:
OLYMPUS MEDICAL SYSTEMS CORP (JP)
International Classes:
H04N5/374; A61B1/04; H04N5/225
Foreign References:
JP2003209751A2003-07-25
JP2013027418A2013-02-07
JP2010274027A2010-12-09
JP2012085923A2012-05-10
JP2013034546A2013-02-21
JP2005334509A2005-12-08
JP2002159439A2002-06-04
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
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