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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2019/163909
Kind Code:
Provided is an imaging unit that can prevent warping of an imaging element chip and improve imaging quality, and an imaging device comprising this imaging unit. This imaging unit (50) comprises: a package (2) to which an imaging element chip (1) is fixed, said package (2) having a fixed first linear expansion coefficient; and a circuit board (52) fixed to the package (2). The circuit board (52) includes: electrically conductive layers (51t)-(58t) that have the first linear expansion coefficient; and insulating layers (51s)-(57s) that have a second linear expansion coefficient that is smaller than the first linear expansion coefficient, and that is greater than the linear expansion coefficient of a semiconductor substrate constituting the imaging element chip (1). The electrically conductive layer content of a back side part B of the circuit board (52) is greater than the electrically conductive layer content of a front side portion S of the circuit board (52).

MAYUMI Kazuya (1-324 Uetake-cho, Kita-ku, Saitama-sh, Saitama 24, 〒3319624, JP)
Application Number:
Publication Date:
August 29, 2019
Filing Date:
February 21, 2019
Export Citation:
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FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome Minato-k, Tokyo 20, 〒1068620, JP)
International Classes:
H01L27/146; H01L23/02; H01L23/08; H04N5/225; H04N5/335
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (Toranomon East Bldg. 9F, 7-13 Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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