Title:
IMAGING UNIT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/208415
Kind Code:
A1
Abstract:
The present invention is characterized by comprising: a plurality of input wires for controlling a semiconductor chip; a plurality of first electrodes connected to the input wires; and an input connector connected to the input wires, a substrate including, on a surface opposite the surface on which the semiconductor chip is mounted, a first region for mounting an electronic component and a second region used for mounting the semiconductor chip, the connector being provided in the first region, and at least one of the first electrodes being provided in the second region.
Inventors:
KISHI TAKAFUMI (JP)
Application Number:
PCT/JP2019/016760
Publication Date:
October 31, 2019
Filing Date:
April 19, 2019
Export Citation:
Assignee:
CANON KK (JP)
International Classes:
H01L25/00; G03B17/02; H01L21/60; H01L23/02; H01L23/10; H05K1/18
Domestic Patent References:
| WO2015099140A1 | 2015-07-02 |
Foreign References:
| JP2017037204A | 2017-02-16 | |||
| JP2005268602A | 2005-09-29 | |||
| JPH03241842A | 1991-10-29 | |||
| JP2015012211A | 2015-01-19 | |||
| JP2018087519A | 2018-06-07 |
Other References:
See also references of EP 3787023A4
Attorney, Agent or Firm:
ABE Takuma et al. (JP)
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