Title:
IMAGING UNIT, IMAGING MODULE AND ENDOSCOPIC SYSTEM
Document Type and Number:
WIPO Patent Application WO/2016/111075
Kind Code:
A1
Abstract:
Provided are an imaging unit, an imaging module, and an endoscopic system, which are capable of obtaining a high quality image while reducing the diameter of the front end of an insertion unit. This imaging unit 10 is provided with: a semiconductor package 20 which has an imaging element and in which a connection electrode 21 is formed on an f2 plane; a first laminate substrate 30 which has connection electrodes 31, 33 on planes f3 and f4 and is connected to the semiconductor package 20 through the connection electrode 31; a second laminate substrate 40, which is connected to the first laminate substrate 30 such that the lamination direction thereof is perpendicular to that of the first laminate substrate 30; an electronic component 51 embedded in the first laminate substrate 30; and a cable 60 connected to the second laminate substrate 40, the imaging unit being characterized in that the first and second laminate substrates 30 and 40 form a T shape in which the second laminate substrate 40 is connected to the first laminate substrate 30, and lie within a projection plane in the optical axis direction of the semiconductor package 20.
Inventors:
ISHIKAWA SHINYA (JP)
WATAYA YUICHI (JP)
MURAMATSU AKIRA (JP)
WATAYA YUICHI (JP)
MURAMATSU AKIRA (JP)
Application Number:
PCT/JP2015/080527
Publication Date:
July 14, 2016
Filing Date:
October 29, 2015
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
H04N5/225; A61B1/04; H01L23/12; H01L23/32; H05K9/00
Domestic Patent References:
| WO2011030608A1 | 2011-03-17 | |||
| WO2014208171A1 | 2014-12-31 | |||
| WO2014208206A1 | 2014-12-31 |
Other References:
See also references of EP 3244603A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Patent business corporation Sakai international patent firm (JP)
Patent business corporation Sakai international patent firm (JP)
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