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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2019/176601
Kind Code:
Provided are an imaging unit which is easily handled during manufacturing and in which image deterioration is prevented, and an oblique endoscope. This imaging unit 30 is characterized by comprising: a semiconductor package 25 which is used in an oblique endoscope in which an endoscope axis O2, which is the longitudinal direction of a distal-end part 6a of an endoscope, and the optical axis O1 of a lens unit 22, which is the observation direction, intersect at an acute angle, the semiconductor package 25 having an imaging element for converting an optical image to an image signal, a light-receiving surface of the imaging element being disposed orthogonal to the optical axis O1 of the lens unit 22, and a sensor electrode being formed on a back surface of the semiconductor package 25; a first circuit substrate 31 having a first connection electrode on the front surface thereof and a second connection electrode 33 on the back surface thereof, an electronic component 50 being mounted on the first circuit substrate 31; and a second circuit substrate 40 having a first region 41 in which a third connection electrode is provided, the first region 41 forming an inclined surface orthogonal to the optical axis O1, and a second region 42 in which a cable connection electrode is provided.

ICHIHARA, Hirokazu (2951 Ishikawa-machi, Hachioji-sh, Tokyo 07, 〒1928507, JP)
Application Number:
Publication Date:
September 19, 2019
Filing Date:
March 01, 2019
Export Citation:
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OLYMPUS CORPORATION (2951, Ishikawa-machi Hachioji-sh, Tokyo 07, 〒1928507, JP)
International Classes:
A61B1/04; A61B1/00; A61B1/05; G02B23/24; H04N7/18
Domestic Patent References:
Foreign References:
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (Toranomon Mitsui Building, 8-1 Kasumigaseki 3-chome, Chiyoda-k, Tokyo 13, 〒1000013, JP)
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