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Patent Searching and Data


Title:
IMMERSION BOILING COOLING METHOD, IMMERSION BOILING COOLING DEVICE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/179571
Kind Code:
A1
Abstract:
These immersion boiling cooling devices (100, 200) are provided with: a sealed container (11) that holds a refrigerant (41); and a thermal diffusion plate (31) including a guide (32). At least a portion of the main surface of a circuit board (21) is disposed so as to rise up onto the sealed container (11) while immersed in the refrigerant (41) in the sealed container (11). The circuit board (21) has a plurality of heating elements (22) mounted thereon, wherein the heating elements are disposed on the main surface of the circuit board (21) in parallel with the direction in which the circuit board (21) rises up. The thermal diffusion plate (31) is attached to at least one of the plurality of heating elements (22), the guide (32) is disposed in an upper portion of the thermal diffusion plate (31), and the main surface of the guide (32) crosses the main surface of the thermal diffusion plate (31). Thus, for example, miniaturization can be achieved.

Inventors:
ISHIHARA KUNIHIKO (JP)
CHIBA MASAKI (JP)
WADA MIZUKI (JP)
Application Number:
PCT/JP2017/040895
Publication Date:
October 04, 2018
Filing Date:
November 14, 2017
Export Citation:
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Assignee:
NEC CORP (JP)
International Classes:
H01L23/44; F28F13/02; H05K7/20
Foreign References:
JPS61176141A1986-08-07
US20160234970A12016-08-11
JPH0162732U1989-04-21
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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