Title:
IMMUNOASSAY METHOD AND CHIP
Document Type and Number:
WIPO Patent Application WO/2007/138789
Kind Code:
A1
Abstract:
It is intended to provide an immunoassay method which is appropriately conducted on
a chip. Namely, an immunoassay method comprising: forming an antigen-antibody complex,
wherein an antigen (2) to be assayed is bonded to an antibody (3), in a reaction
chamber (7); and measuring the amount of the antigen-antibody complex or the
antibody not binding to the antigen to be assayed by using an assay solution prepared
by using a sample solution (8) as a solvent. According to this method, the assay
solution for detecting a signal indicating the amount of the antigen to be assayed
can be obtained without resorting to a buffer solution free from no substance
to be assayed such as a protein. Therefore, it is unnecessary to supply the buffer
from the outside of the chip or preliminarily allow the chip to hold the buffer,
which makes it possible to easily conduct the immunoassay on the chip.
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Inventors:
HATAOKA, Yukari (())
Application Number:
JP2007/057830
Publication Date:
December 06, 2007
Filing Date:
April 09, 2007
Export Citation:
Assignee:
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1006, Oaza Kadoma Kadoma-sh, Osaka 01, 5718501, JP)
松下電器産業株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 5718501, JP)
松下電器産業株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 5718501, JP)
International Classes:
G01N33/53; G01N33/536; G01N33/543; G01N37/00
Attorney, Agent or Firm:
KAMADA, Koichi (7th Fl, TOMOE MARION BLDG.4-3-1, Nishitenma, Kita-k, Osaka-shi Osaka 47, 5300047, JP)
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