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Patent Searching and Data


Title:
IMPEDANCE MATCHING CIRCUIT, HIGH-FREQUENCY WELDING DEVICE, AND CONTINUOUS FILLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/170985
Kind Code:
A1
Abstract:
Provided is a technique for stabilizing welding strength during high-frequency welding. An impedance matching circuit (E) is connected between a sealing electrode (8a) for high-frequency welding of a tubular body (F2) and a high-frequency output unit (A) for supplying high-frequency electric power between the sealing electrode and an earth electrode (8b). The impedance matching circuit (E) has passing characteristics such that at a frequency fc that corresponds to the design frequency at the high-frequency output unit, the signal level of the high-frequency electric power reaches a peak, and the half-value width is not less than 0.15 times the frequency.

Inventors:
SEYA, Kiyomi (3-3-2 Nihonbashi-Hamacho, Chuo-k, Tokyo 52, 〒1038552, JP)
Application Number:
JP2016/061282
Publication Date:
October 27, 2016
Filing Date:
April 06, 2016
Export Citation:
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Assignee:
KUREHA CORPORATION (3-3-2, Nihonbashi-Hamacho Chuo-k, Tokyo 52, 〒1038552, JP)
International Classes:
B65B51/10; A22C11/00; A22C13/00; B29C65/04; B65B51/26
Foreign References:
JPH06238754A1994-08-30
JPH1119945A1999-01-26
JP2014101534A2014-06-05
JPS5232785B21977-08-24
Other References:
YOSHIHIRO KONISHI: "Micro-ha Kairo no Kiso to sono Oyo", SOGO DENSHI SHUPPANSHA, vol. 119, no. third edition, 10 June 1995 (1995-06-10), pages 159 - 164
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (Daiwa Minamimorimachi Building, 2-6 Tenjinbashi 2-chome Kita, Kita-ku, Osaka-sh, Osaka 41, 〒5300041, JP)
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