Title:
IMPEDANCE MATCHING ELEMENT, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/230027
Kind Code:
A1
Abstract:
An impedance matching element (10), provided with a semiconductor substrate (20), a first terminal (P11), and a second terminal (P12). The first terminal (P11) is formed on the semiconductor substrate (20) and is connected to the antenna (91). The second terminal (P12) is formed on the semiconductor substrate (20) and is connected to a high-frequency circuit (92). The semiconductor substrate (20) has a first region and a second region. The first region is provided with a first PN junction, and has a rectification effect of channeling a current from the first terminal (P11) to the second terminal (P12) in a steady state. The second region is provided with a second PN junction, and has a rectification effect of channeling a current from the second terminal (P12) to the first terminal (P11) in a steady state. The first region and the second region are connected between the first terminal (P11) and the second terminal (P12) and have a breakdown voltage in both directions.
Inventors:
UEKI NORIYUKI (JP)
Application Number:
PCT/JP2018/047441
Publication Date:
December 05, 2019
Filing Date:
December 25, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H5/12; H01L21/329; H01L21/331; H01L29/732; H01L29/861; H01L29/866; H01L29/868; H03H7/38; H03H11/28; H04B1/18; H04B1/40
Domestic Patent References:
| WO2007135821A1 | 2007-11-29 | |||
| WO2018066578A1 | 2018-04-12 | |||
| WO2018150881A1 | 2018-08-23 |
Foreign References:
| JP2014530543A | 2014-11-17 | |||
| JP2008544494A | 2008-12-04 | |||
| JP2013026249A | 2013-02-04 | |||
| JP2004214353A | 2004-07-29 | |||
| JP2015082699A | 2015-04-27 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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