Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
IMPREGNATED CATHODE STRUCTURE AND METHOD OF MANUFACTURING THE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2002/054434
Kind Code:
A1
Abstract:
An impregnated cathode structure and a method of manufacturing the structure capable of firmly connecting a porous base metal to a cup body without using an intervenient and increasing the reliability of welding between the porous base metal and the cup body and an yield by eliminating the occurrence of defective welding; the impregnated cathode structure, comprising the porous base metal (11) impregnated with emissive materials and the cup body (12) allowing the surface of the porous base metal (11) to expose and holding the porous base metal (11) so as to cover the bottom and side faces thereof, wherein a non-porous dense part (14) is formed at the bottom face of the porous base metal (11), a close-fitted area (16) is formed by pressingly deforming the bottom part of the cup body (12) along the shape of the dense part (14), and the bottom part of the cup body (12) is welded to the dense part (14) of the porous base metal (11) in the close-fitted area (16).

More Like This:
JP57084543IMPREGNATION TYPE CATHODE FRAME
JP59105233POROUS TUNGSTEN SINTERED SUBSTANCE
JP2005276641MANUFACTURING METHOD OF MATRIX MATERIAL AS WELL AS MATRIX TYPE CATHODE STRUCTURE, AND ITS MANUFACTURING METHOD
Inventors:
Imabayashi, Daichi c/o SONY CORPORATION 7-35 (Kitashinagawa 6-chome Shinagawa-ku, Tokyo, 141-0001, JP)
Application Number:
PCT/JP2001/011468
Publication Date:
July 11, 2002
Filing Date:
December 26, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SONY CORPORATION (7-35, Kitashinagawa 6-chome Shinagawa-ku, Tokyo, 141-0001, JP)
Imabayashi, Daichi c/o SONY CORPORATION 7-35 (Kitashinagawa 6-chome Shinagawa-ku, Tokyo, 141-0001, JP)
International Classes:
H01J1/28; H01J9/04; H01J1/20; H01J9/04; (IPC1-7): H01J1/28; H01J9/04
Attorney, Agent or Firm:
Nakamura, Tomoyuki c/o Miyoshi International Patent Office 9th Floor (Toranomon Daiichi Building 2-3 Toranomon 1-chome Minato-ku, Tokyo, 105-0001, JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ELECTRIC FUSE FOR ELECTRICAL MACHINES

Next Patent: A METHOD FOR SEALING A FLAT PANEL DISPLAY IN A VACUUM