Title:
IMPRINTING METHOD AND IMPRINTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2007/105474
Kind Code:
A1
Abstract:
In an imprinting method, a mold (3) having a pattern formed on the surface is pressed to
a transfer layer (1a) on a substrate (1) and the pattern shape of the mold (3) is
transferred to the transfer layer (1a). The outer circumference portion on the
surface of the mold (3) is pressed to a mold holding member (4) by a pressing member
(5), and in such status, the mold (3) is pressed to the transfer layer (1a) on the
substrate (1). Thus, pattern shape shift due to thermal deformation of the mold
in the imprinting method is prevented, and the pattern shape is accurately formed
on the substrate.
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Inventors:
IMAI TETSUYA (JP)
Application Number:
PCT/JP2007/053517
Publication Date:
September 20, 2007
Filing Date:
February 26, 2007
Export Citation:
Assignee:
PIONEER CORP (JP)
IMAI TETSUYA (JP)
IMAI TETSUYA (JP)
International Classes:
B29C33/20; B29C59/02; H01L21/027
Foreign References:
| JP2006018977A | 2006-01-19 | |||
| JPS62103116A | 1987-05-13 |
Attorney, Agent or Firm:
MIZUNO, Katsufumi et al. (2-3 Marunouchi 2-chom, Chiyoda-ku Tokyo 05, JP)
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