Title:
IMPROVED COATING FOR SILVER PLATED CIRCUITS
Document Type and Number:
WIPO Patent Application WO2004094682
Kind Code:
B1
Abstract:
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion or electroless silver plate prior to soldering, after which immersion silver plate is treated with an alkaline polymer coating comprising aqueous vinyl polymers, aqueous acrylic polymers, anti-fungal agents and a benzotriazole or benzimidazole compound to produce a deposit that is resistant to electromigration and that provides an anti-tarnish and anti-corrosion coating on the surface.
Inventors:
REDLINE RONALD
ANGELONE DAVID
CASTALDI STEVEN A
TOSCANO LENORA
ANGELONE DAVID
CASTALDI STEVEN A
TOSCANO LENORA
Application Number:
PCT/US2004/007773
Publication Date:
February 17, 2005
Filing Date:
March 15, 2004
Export Citation:
Assignee:
MACDERMID INC (US)
International Classes:
C23C18/42; H05K3/28; B05D1/18; B05D3/02; B05D7/14; H05K3/24; (IPC1-7): B05D1/18; B05D1/36; B05D3/10; C23C22/00
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