IMPROVED HEAT SINK AND HEAT DISSIPATION STRUCTURE - TTI MACAO COMMERCIAL OFFSHORE LTD

Title:

IMPROVED HEAT SINK AND HEAT DISSIPATION STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2018/053729

Kind Code:

A1

Abstract:

A printed circuit board assembly (PCBA) has a heat source, a heat sink, and an exit vent. The heat source generates heat, typically excessive heat and the heat sink conducts heat from the heat source and heats up the surrounding air to form heated air. The heated air then passes through the exit vent which is positioned adjacent to the heat sink. In addition, a heat dissipation structure contains a fan to move air, a heat source distal from the fan, an exit vent proximal to the fan, and an airflow path running from the heat source to the fan to the exit vent. The heat source heats the air to form heated air. When the fan is activated, the fan draws air through the airflow path from the heat source and out of the exit vent.

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Inventors:

LEE HEI MAN RAYMOND (CN)

Application Number:

PCT/CN2016/099638

Publication Date:

March 29, 2018

Filing Date:

September 21, 2016

Export Citation:

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Assignee:

TTI MACAO COMMERCIAL OFFSHORE LTD (CN)

International Classes:

A01D34/00; B25F5/00; B25F5/02; H05K7/20

Domestic Patent References:

WO2013112469A1

2013-08-01

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