Title:
IMPROVED MECHANICAL SUPPORT FOR A THIN-FILM THERMOELECTRIC COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/127416
Kind Code:
A3
Abstract:
An improved mechanical support for a personal heat control device is provided. The improved mechanical support includes a heat sink, a heat spreader assembly, a heat pump and a plurality of mechanical support structures. The heat sink has a hot side and the heat spreader assembly is disposed adjacent the heat sink at the hot side. The heat pump is disposed at the hot side. The plurality of mechanical support structures are configured and arranged to support the heat sink on the heat spreader assembly.
Inventors:
ARNOLD ANTHONY P (US)
MAHADEVAN RAMASWAMY (US)
MAHADEVAN RAMASWAMY (US)
Application Number:
PCT/US2011/031807
Publication Date:
February 02, 2012
Filing Date:
April 08, 2011
Export Citation:
Assignee:
ARNOLD ANTHONY P (US)
MAHADEVAN RAMASWAMY (US)
MAHADEVAN RAMASWAMY (US)
International Classes:
H05K7/20; F25B21/02; H01L23/34
Foreign References:
| US7440283B1 | 2008-10-21 |
Other References:
PAUL MAGILL: "CMOS DETECTORS: Thin-film TECs give new life to CMOS cooling. LaserFocusWorld", 1 August 2007 (2007-08-01), Retrieved from the Internet
Attorney, Agent or Firm:
LENZEN, Glenn (1700 Lincoln Street Suite 470, Denver CO, US)
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