Title:
IMPROVED STRUCTURAL RIVET FOR FORMING FLAT-BOTTOM RIVETING OF PLATE
Document Type and Number:
WIPO Patent Application WO/2023/083124
Kind Code:
A1
Abstract:
Provided are an improved structural rivet for forming flat-bottom riveting of a plate, and a point connection device and method therefor. The improved structural rivet comprises: a rivet cover (101, 201, 301), a rivet shoulder (102, 202, 302) and a rivet body (103, 203, 303), wherein the rivet cover (101, 201, 301) is provided with a torque transmission structure for driving the rivet to rotate, and a positioning structure; and the rivet body (103, 203, 303) comprises a rivet body inner cavity (104, 204, 304), a rivet body outer wall (105, 205, 305) and a rivet body end portion (106, 206, 306). By means of the rivet, a bottom face (10, 18, 26) of a joint can be flush with a surface of a connected material, subsequent coverage processing on the bottom face is facilitated, the wind resistance coefficient of the joint is reduced, and the application range of the process is widened. Moreover, the joint performance is enhanced by means of mechanical fitting formed between a fitting structure on the rivet body (103, 203, 303) and the connected material. In addition, the point connection method can realize a detachable joint or a non-detachable joint according to actual requirements, and the flexibility is good.
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Inventors:
LI YONGBING (CN)
MA YUNWU (CN)
LOU MING (CN)
SHAN HE (CN)
YANG BINGXIN (CN)
MA YUNWU (CN)
LOU MING (CN)
SHAN HE (CN)
YANG BINGXIN (CN)
Application Number:
PCT/CN2022/130157
Publication Date:
May 19, 2023
Filing Date:
November 05, 2022
Export Citation:
Assignee:
UNIV SHANGHAI JIAOTONG (CN)
International Classes:
F16B19/10; B21J15/02
Foreign References:
| CN114233733A | 2022-03-25 | |||
| CN106112543A | 2016-11-16 | |||
| CN105422573A | 2016-03-23 | |||
| US20100088880A1 | 2010-04-15 | |||
| KR20180076183A | 2018-07-05 | |||
| CN113494509A | 2021-10-12 | |||
| CN105728627A | 2016-07-06 | |||
| CN112555254A | 2021-03-26 |
Attorney, Agent or Firm:
SHANGHAI JIAODA PATENT AGENCY (CN)
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