IN-MOLD LABEL AND CONTAINER FITTED WITH LABEL

Title:

IN-MOLD LABEL AND CONTAINER FITTED WITH LABEL

Document Type and Number:

WIPO Patent Application WO/2018/062214

Kind Code:

A1

Abstract:

An in-mold label characterized by having a low-melting-point resin layer (B) and a heat seal layer (C) on one side of a thermoplastic film (A) in the order stated, the melting point of a resin that the low-melting-point resin layer contains being 60-110℃, the heat seal layer (C) containing a thermoplastic resin having polar constituent units, the thickness of the heat seal layer (C) being 0.05 μｍ or more to less than 2 μｍ, the in-mold label sticking to a polar resin container even when a non-polar resin is used for an adhesive layer and further having high strength of adhesive bonding under the low temperature adhesion condition of stretch blow molding; a container fitted with the label.

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Inventors:

HONDA SHUNSUKE (JP)
ZAMA TAKAHIRO (JP)
IWASAWA YUTA (JP)

Application Number:

PCT/JP2017/034824

Publication Date:

April 05, 2018

Filing Date:

September 27, 2017

Export Citation:

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Assignee:

YUPO CORP (JP)

International Classes:

B29C48/15; G09F3/04; B29C33/14; B29C48/16; B32B7/02; B32B27/00; B32B27/36; B65D23/08

Foreign References:

JP2002113771A	2002-04-16
JPH08254956A	1996-10-01
JP2002160287A	2002-06-04

Attorney, Agent or Firm:

SIKS & CO. (JP)

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