Title:
IN-MOLD LABEL AND IN-MOLD MOLDING
Document Type and Number:
WIPO Patent Application WO/2018/003803
Kind Code:
A1
Abstract:
The present invention provides an in-mold label of which the printed layer is protected in a state of being stuck to a resin molding and the printed content is visible and which has sufficient adhesiveness, and a container fitted with a label which is provided with this in-mold label. An in-mold label 3 provided in a resin molding 2, wherein the in-mold label 3 is provided with a base layer 21 that includes a thermoplastic resin, and a printed layer 11, the printed layer 11 including a coloring material and an ethylene copolymer, the printed layer 11 being heat-fusible to the wall surface of the resin molding 2, the opacity of the base layer 21 being 40% or below.
Inventors:
IKARASHI TAKUYA (JP)
NAKAMURA KOU (JP)
NAKAMURA KOU (JP)
Application Number:
PCT/JP2017/023592
Publication Date:
January 04, 2018
Filing Date:
June 27, 2017
Export Citation:
Assignee:
YUPO CORP (JP)
International Classes:
G09F3/04; B65D25/20; G09F3/02; B32B27/32
Domestic Patent References:
| WO2007023843A1 | 2007-03-01 | |||
| WO2004049284A1 | 2004-06-10 | |||
| WO1998032598A1 | 1998-07-30 |
Foreign References:
| JP2002328607A | 2002-11-15 | |||
| JP2014224882A | 2014-12-04 | |||
| JP2002351323A | 2002-12-06 |
Attorney, Agent or Firm:
SANADA, Tamotsu (JP)
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