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Title:
INDIRECT THERMOFORMING MOLD AND METHOD FOR ALUMINUM ALLOY
Document Type and Number:
WIPO Patent Application WO/2024/060624
Kind Code:
A1
Abstract:
An indirect thermoforming mold for an aluminum alloy, comprising an upper mold (4) and a lower mold (5). The upper mold (4) is connected to a pressure device; the pressure device is used for driving the upper mold (4) to move up and down so as to realize opening or closing of the upper mold (4) and the lower mold (5); a first cooling mechanism is arranged at the bottom of the upper mold (4); a heating mechanism is arranged at the top of the lower mold (5); a second cooling mechanism is arranged on the periphery of the lower mold (5). An indirect thermoforming method for an aluminum alloy is implemented by adopting the indirect thermoforming mold for an aluminum alloy.

Inventors:
ZHANG QUANDA (CN)
SUN FUZHEN (CN)
Application Number:
PCT/CN2023/091322
Publication Date:
March 28, 2024
Filing Date:
April 27, 2023
Export Citation:
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Assignee:
BEIJING NAT INNOVATION INSTITUTE OF LIGHTWEIGHT LTD (CN)
BEIJING NAT INNOVATION INSTITUTE OF LIGHTWEIGHT LTD YANTAI BRANCH (CN)
CHINA ACADEMY OF MACHINERY SCIENCE AND TECH GROUP (CN)
International Classes:
B21D37/10; B21D22/02; B21D37/16; C21D1/673; C22F1/04
Domestic Patent References:
WO2014068494A12014-05-08
Foreign References:
CN115532947A2022-12-30
CN102615201A2012-08-01
CN111014406A2020-04-17
CN105107939A2015-12-02
CN107344202A2017-11-14
Attorney, Agent or Firm:
KANGXIN PARTNERS, P.C. (CN)
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