INDUCTIVE COUPLING STRUCTURE, MULTI-LAYER TRANSMISSION-LINE PLATE, METHOD OF MANUFACTURING INDUCTIVE COUPLING STRUCTURE, AND METHOD OF MANUFACTURING MULTI-LAYER TRANSMISSION-LINE PLATE

WIPO Patent Application WO/2011/111605

A1

Disclosed is an inductive coupling structure to be used in a microwave frequency band, and which is provided with: a laminate that is laminated by having an inner dielectric layer (23) sandwiched in between inner conductive layers (12, 15) that will become a plurality of ground layers; a pair of outer dielectric layers (21, 25) that are opposed to each other with the laminate sandwiched therebetween; and a pair of outer conductive layers (11, 16) that are opposed to each other with the pair of outer dielectric layers (21, 25) sandwiched therebetween. A hole (S) that penetrates the inner dielectric layer (23) and the inner conductive layers (12, 15) that will become a plurality of ground layers is formed on the laminate, and the pair of outer conductive layers (11, 16) are inductively coupled, by making the inner conductive layers (12, 15) that will become a plurality of ground layers electrically connected via a tubular metal film (3) formed on the inner wall of the hole (S).

MIZUSHIMA ETSUO (JP)
KONDOU YUUSUKE (JP)
MIZUNO YASUYUKI (JP)
WATANABE YASUSHI (JP)

PCT/JP2011/054946

September 15, 2011

March 03, 2011

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HITACHI CHEMICAL CO LTD (JP)
MIZUSHIMA ETSUO (JP)
KONDOU YUUSUKE (JP)
MIZUNO YASUYUKI (JP)
WATANABE YASUSHI (JP)

H05K3/46; H01P1/04; H01P5/107

JP2007243123A	2007-09-20
JPH05273234A	1993-10-22
JPS61162101U	1986-10-07
JP2004187281A	2004-07-02
JP2007243123A	2007-09-20

HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)

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