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Title:
INDUCTOR COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/186148
Kind Code:
A1
Abstract:
An inductor component comprising an outer packaging, a coil part embedded within the outer packaging, a first outer electrode extended from the coil part, and a second outer electrode extended from a second end of the coil part. The outer packaging has a bottom surface, a top surface, a first and a second side surface on mutually opposite sides, and a third and a fourth side surface on mutually opposite sides. Provided to the bottom surface of the outer packaging is a first step part that is depressed toward the top surface and opens in the third side surface, the first outer electrode coming into contact with the first step part. Also provided to the bottom surface of the outer packaging is a second step part that is depressed toward the top surface and opens in the fourth side surface, the second outer electrode coming into contact with the second step part. Also provided to the bottom surface is a third step part that is connected to the first step part and is depressed toward the top surface. Also provided to the bottom surface is a fourth step part that is connected to the second step part and is depressed toward the top surface. The inductor component makes it possible to improve solder wettability during reflow soldering.

Inventors:
KATAOKA Keito
UEDA Hideki
Application Number:
JP2018/010498
Publication Date:
October 11, 2018
Filing Date:
March 16, 2018
Export Citation:
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Assignee:
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (1-61, Shiromi 2-chome Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
International Classes:
H01F27/29; H01F37/00; H01F41/04
Domestic Patent References:
WO2015115024A12015-08-06
Foreign References:
JP2014132630A2014-07-17
JP2012169587A2012-09-06
JP2006120887A2006-05-11
JP2013045871A2013-03-04
Attorney, Agent or Firm:
KAMATA Kenji et al. (1-61, Shiromi 2-chome, Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
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