Title:
INDUCTORS FOR CHIP TO CHIP NEAR FIELD COMMUNICATION
Document Type and Number:
WIPO Patent Application WO/2018/228581
Kind Code:
A1
Abstract:
A device includes a first inductor positioned on a first substrate. The first inductor has at least one turn in a plane that is perpendicular to a plane of the first substrate. The first inductor is positioned for near field coupling with a second inductor. The second inductor is positioned on a second substrate, with at least one turn that is in a plane perpendicular to a plane of the second substrate. The second inductor is substantially parallel to the first inductor. Such an arrangement may be used for near field coupling, including edge-to-edge coupling, between two integrated circuits.
Inventors:
CHONG EUHAN (CA)
TONIETTO DAVIDE (CA)
XIANG ZHONGGUI (CA)
TONIETTO DAVIDE (CA)
XIANG ZHONGGUI (CA)
Application Number:
PCT/CN2018/091750
Publication Date:
December 20, 2018
Filing Date:
June 19, 2018
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01F17/00
Foreign References:
| US20160358709A1 | 2016-12-08 | |||
| CN106062903A | 2016-10-26 | |||
| CN103377809A | 2013-10-30 |
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