Title:
INERTIAL SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2013/145828
Kind Code:
A1
Abstract:
An objective of the present invention is, when a pad is disposed other than at an end point on an LSI-side in a sensor module with which changing a detection axis of a physical quantity is possible, to solve such problems as increased chip surface area and increased development costs resulting from guide wiring for connecting the pad. In an inertial sensor module are disposed a first pad group (120), a second pad group (130) which is electrically connected to the first pad group and is disposed in a location rotated 90 degrees with respect to the first pad group, a first sensor element (100) which has a detection axis, and an LSI (202) which controls the first sensor element. The first sensor element is disposed along a first side of the LSI, a plurality of third pad groups (203) are disposed along a second side of the LSI which intersects the first side, and the third pad groups are electrically connected to either the first pad group or the second pad group.
Inventors:
YAMANAKA KIYOKO (JP)
JEONG HEEWON (JP)
HAYASHI MASAHIDE (JP)
JEONG HEEWON (JP)
HAYASHI MASAHIDE (JP)
Application Number:
PCT/JP2013/051519
Publication Date:
October 03, 2013
Filing Date:
January 25, 2013
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
G01C19/5783; G01P15/08; G01P15/18
Foreign References:
| JP2005169541A | 2005-06-30 | |||
| JP2009130056A | 2009-06-11 | |||
| JP2003156511A | 2003-05-30 | |||
| JP2010139430A | 2010-06-24 | |||
| JP2003202226A | 2003-07-18 | |||
| JP2009168777A | 2009-07-30 |
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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