Title:
INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/095476
Kind Code:
A1
Abstract:
An information processing device according to one aspect of the present disclosure comprises an estimation unit and a determination unit. The estimation unit estimates an adhesion strength on the basis of data having correlation with the adhesion strength between a contact surface of a base part and a surface to be contacted that adheres the base part, the data being obtained using a sensor. The determination unit determines the stability of the base part on the surface to be contacted on the basis of the adhesion strength estimated by the estimation unit.
Inventors:
ODA TOMOHITO (JP)
MOTOISHI TAKUYA (JP)
TANAKA HIROTAKA (JP)
MOTOISHI TAKUYA (JP)
TANAKA HIROTAKA (JP)
Application Number:
PCT/JP2022/038024
Publication Date:
June 01, 2023
Filing Date:
October 12, 2022
Export Citation:
Assignee:
SONY GROUP CORP (JP)
International Classes:
B25J19/00; G06F1/16
Foreign References:
| JP2020138289A | 2020-09-03 | |||
| JPH06155368A | 1994-06-03 | |||
| JP2017164872A | 2017-09-21 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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